Sink thermal paste conductive

this paste is basically a thermally conductive material. this paste used as an interface between the heat sink and heat sources. this paste can be used in high-power semiconductor devices. this heat sink paste is used to fill the space and all imperfections on the heat sink. Non-toxic,tasteless,non-corrosive Primary Use:Thermal coupling of electrical/electronic devices to heat sinks Special Properties:High conductivity;low bleed;Stable at high temperatures it has the capability of withholding 300-degree centigrades. it saves the loss of heat which causes the loss in the heat sink’s performance.

1.High Grade Stability And Reliability. 2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components. 3.Helps Disperse The Heat From CPU To Heatsink Effectively. 4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer. 5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.

High Grade Stability And Reliability. Apply to CPU, VGA, Chipset, Radiator And Other PC Components. Helps Disperse The Heat From CPU To Heatsink Effectively. Low Thermal Resistance And High Conductivity For Superior Heat Transfer. High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.

High grade stability and reliability. Apply to CPU, VGA, chipset, radiator and other PC components. Helps disperse the heat from CPU to heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High temperature resistance. Non-toxic, tasteless, non-corrosive.

99.99% brand new and high quality thermal grease paste Non-toxic, tasteless, non-corrosive High stability and reliability Low thermal resistance and high thermal conductivity Apply to CPU, VGA,LED Chipset and other PC components Compliance with RoHS REACH PFOS requirement Material: Silicone Grease Net Weight: 10g Thermal conductivity: > 1.93 W/m-k Thermal Impedance: <0.225 Specific Gravity: >2.0 Viscosity: 1000 Concentration: 380±10 1/10mm Working temperature: ?50-300°

KRYONAUT The  Kryonaut thermal  paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community.  Kryonaut  is also recommended as a top product for critical cooling systems in the industrial sector. Especially for overclocking Excellent thermal conductivity No curing High long-term stability Not electrically conductive Applicable to aluminum coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity ***** Sub-zero overclocking ***** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - "Kryo" - the Greek word for "cold", which is also used in cryotechnology - indicates that the   Kryonaut  thermal paste is specially designed for use in the low-temperature range - it was developed for the true "cryonauts" among the "extreme overclockers". Kryonaut  uses a special support structure that does not begin to dry out even at 80 ° C. This support structure ensures that the nano-aluminium and zinc oxide components of the paste are optimally combined and unevenness in the heat carrier (e.g. the CPU) and a heat sink (e.g. heat sink) are optimally compensated for with excellent thermal conductivity.

HYDRONAUT With its excellent thermal conductivity,  Hydronaut  can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example. Suitable for overclocking  Excellent thermal conductivity No curing Silicone free Not electrically conductive Applicable to aluminium coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity **** Sub-zero overclocking **** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications ***** The  Hydronaut  Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector. The  Hydronaut  thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily. Hydronaut  achieves optimal values ??for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users. Thermal resistance 0.0076 K / W Electrical conductivity * 0 pS / m  viscosity  140-190 pas  Spec. Weight   2.6g / cm3  temperature  -200 ° C / +350 ° C  content  1.5ml / 3.9g - 3ml / 7.8g    * according to DIN 51412-1

HYDRONAUT With its excellent thermal conductivity,  Hydronaut  can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example. Suitable for overclocking  Excellent thermal conductivity No curing Silicone free Not electrically conductive Applicable to aluminium coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity **** Sub-zero overclocking **** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications ***** The  Hydronaut  Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector. The  Hydronaut  thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily. Hydronaut  achieves optimal values ??for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users. Thermal resistance 0.0076 K / W Electrical conductivity * 0 pS / m  viscosity  140-190 pas  Spec. Weight   2.6g / cm3  temperature  -200 ° C / +350 ° C  content  1g

Thermal Grease Paste Compound Silicone for CPU Heat Sink The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards. Thermal coupling of electrical / electronic device to heat sinks High Thermal Conductivity, Low Bleed and Stable at high temperature

GD900 Thermal Paste Grease Heat Sink Compound High Performance Net Weight 1 Gram For CPU GPU Cooler Gray Conductive Cooling Fan Processors Silicone Plaster

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K Specification Features - High Viscosity Allows For Easy Application - Nanotechnology Improves Heat Conduction - Non-electric Conductive Material Ensure Safe Usage - Low Evaporation Point & High Temperature Tolerance - Spreader Allows For Quick & Easy Application - Thermal Conductivity > 5.15W/m-K

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K

Heat Sink Thermal Grease Paste Grey HY510 For CPU 1Gram This thermal grease is used for most PC and tablet accessories such as CPU, chipset, etc. Syrnge shape can help to use this crease sufficiently and heat evenly. High heat conduction, high insulation. High temperature-resistant nonvolatile. High-grade stability and reliability. Apply to CPU, VGA, chipset, radiator, and other PC components. Helps disperse the heat from the CPU to the heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High-temperature resistance. Non-toxic, tasteless, non-corrosive. Weight: 1g Uses: CPU, Graphics, And Other Hot Chips Thermal Conductivity: > 1.93 W/m-K Thermal Resistance: < 0.225°C-in⊃2;/W Syrnge Shape, Nontoxic, Odorless, Non-corrosive

Heat Sink Thermal Grease Paste Grey HY510 For CPU 30Grams This thermal grease is used for most PC and tablet accessories such as CPU, chipset, etc. Syrnge shape can help to use this crease sufficiently and heat evenly. High heat conduction, high insulation. High temperature-resistant nonvolatile. High-grade stability and reliability. Apply to CPU, VGA, chipset, radiator, and other PC components. Helps disperse the heat from the CPU to the heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High-temperature resistance. Non-toxic, tasteless, non-corrosive. Weight: 30g Uses: CPU, Graphics, And Other Hot Chips Thermal Conductivity: > 1.93 W/m-K Thermal Resistance: < 0.225°C-in⊃2;/W Syrnge Shape, Nontoxic, Odorless, Non-corrosive

Clean up the surface. Use Thermal Grease on the CPU/GPU surface center. Using scraper or other tools to smear the thermal paste onto the CPU. After coating the product，the thickness is based on A4 paper thickness. Color:Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit