Heatsink

Heatsink Plaster Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU Thermal properties, strong glue adhesion.Specifications: 5g (single)Melting amount: 0 (200°C/24 Hours)Evaporation: 0.001% (200°C/24 Hours)Thermal Conductivity: >0.671W/m-KImpedance:<0.06Ging Time: 3min (25°C)Track Strength: 25KgStrength of Connected Buildings: 1.5mapMargin Coefficient: >5.1Scatter Coefficient:<0.005Package Included:1 x Heatsink PlasterProduct type: Thermopaste

brand new and high quality.Increase the reliability of your system by cooling down the memory.Improve RAM performance and avoid system crash by dissipating access RAM heat.Compatible with all standard SDR/DDR SDRAM.Effective size fits all motherboard.

Compatible with G15 5510, G15 5511, G15 5515 2021 15.6 inch Gaming Laptop series. Add M.2 2230 2280 X8MY9 to your laptop with Slot 2. Support the solid-state drive form factors in Slot ONE/TWO: 2230/2280. M.2 Thermal Bracket comes with 2 screws. Part Number: 26X1Y Package included: 1 Piece 2280 M.2 Heatsink Thermal Shield, 1 Piece Bracket Size Chart: Heatsink Size: 3x6x1cm/1.18x2.36x0.39inch Mounting Bracket Size: approx. 4×6×1cm/1.57×2.36×0.39inch

Compatible with G15 5510, G15 5511, G15 5515 2021 15.6 inch Gaming Laptop series. Add.2 2230 2280 X8MY9 to your laptop with Slot 2. Support the solid-state drive form factors Slot ONE/TWO: 2230/2280..2 Thermal Bracket comes with 2 screws. Part Number: 26X1Y Package included: 1 Piece 2280.2 Heatsink Thermal Shield, 1 Piece Bracket Size Chart: Heatsink Size: 3x6x1cm/1.18x2.36x0.39inch Mounting Bracket Size: approx. 4×6×1cm/1.57×2.36×0.39inch

High grade stability and reliability. Apply to CPU, VGA, chipset, radiator and other PC components. Helps disperse the heat from CPU to heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High temperature resistance. Non-toxic, tasteless, non-corrosive. Thermal Grease for Laptop Desktop CPU Cooler heatsink Thermal Compound Paste HY510 (1g) By Shah Ansari

Samsung 1TB 980 PRO NVMe M.2 SSD With Heatsink Price in Pakistan Capacity: 1TB Form Factor: M.2 (2280) Read Speed: 7000MB/s Seq. Write Speed: 5000MB/s Seq.

10x10x1.0mm Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Pad 15 Piece

DESCRIPTION ->This CPU heat sink has six heat pipes for more effective and powerful heat dissipation. ->It can enhance the cooling function of the duct system. ->U-shaped heat pipe can quickly transfer heat from the processor, which has good performance on heat dissipation. ->Bottom wire drawing processing. ->High efficiency and low power consumption. Features: 1.This CPU heat sink has six heat pipes for more effective and powerful heat dissipation. 2.It can enhance the cooling function of the duct system. 3. U-shaped heat pipe can quickly transfer heat from the processor, which has good performance on heat dissipation. 4.Bottom wire drawing processing. 5.High efficiency and low power consumption. 6.Multi-platform adjustable footrest. Specifications: Fan size: 9*9*2.5cm Speed: 2200±10% Noise: 22dBA Voltage: 12VDC Air volume: 48CFM Life: 20,000 hours Fan interface: 3pin Bearing type: hydraulic Color: red, blue, green (optional) Applicable CPU: IntelLGA775: Core2DUO Core 2/Celeronp Celeron / Pentium 4 Pentium 4 / Pentium D Pentium D Intel LGA 1155/1156/1366: Core Core i3/i5/i7 AMD/AM2AM2+/AM3: Sempron Smurron/Athlon Athlon 64/Athlon Athlon X2/Phenom 64 Packaged included: 1 x CPU Heatsink 1 x Mounting Accessories Mention that you found this ad on DealMarkaz.pk when you call.

DESCRIPTION -b'>'This CPU heat sink has six heat pipes for more effective and powerful heat dissipation. -b'>'It can enhance the cooling function of the duct system. -b'>'U-shaped heat pipe can quickly transfer heat from the processor, which has good performance on heat dissipation. -b'>'Bottom wire drawing processing. -b'>'High efficiency and low power consumption. Features: 1.This CPU heat sink has six heat pipes for more effective and powerful heat dissipation. 2.It can enhance the cooling function of the duct system. 3. U-shaped heat pipe can quickly transfer heat from the processor, which has good performance on heat dissipation. 4.Bottom wire drawing processing. 5.High efficiency and low power consumption. 6.Multi-platform adjustable footrest. Specifications: Fan size: 9*9*2.5cm Speed: 2200±10% Noise: 22dBA Voltage: 12VDC Air volume: 48CFM Life: 20,000 hours Fan interface: 3pin Bearing type: hydraulic Color: red, blue, green (optional) Applicable CPU: IntelLGA775: Core2DUO Core 2/Celeronp Celeron / Pentium 4 Pentium 4 / Pentium D Pentium D Intel LGA 1155/1156/1366: Core Core i3/i5/i7 AMD/AM2AM2+/AM3: Sempron Smurron/Athlon Athlon 64/Athlon Athlon X2/Phenom 64 Packaged included: 1 x CPU Heatsink 1 x Mounting Accessories Lal Para, M.A Jinnah Road, Mirpur Khas, Sindh, Pakistan

Condition Used / Seller Refurbished pulled from branded PCs Cooler One Socket-1156 Cooler supports Intel Core i7, Core i3 and Core i5 LGA-1150/1151/1155/1156 processors with up to 95W TDP (Thermal Design Power). Aluminum heat sink with Copper Core 3.5-inch fan Supports Intel Core i7, Core i3 and Core i5 Socket 1155/1156 processors with up to 95W TDP (Thermal Design Power) Supports Intel CPU socket type: LGA 1150 / 1151 / 1155 / 1156

Condition Used / Seller Refurbished pulled from branded PCs Cooler One Socket-1156 Copper Core Cooler supports Intel Core i7, Core i3 and Core i5 LGA-1150/1151/1155/1156 processors with up to 95W TDP (Thermal Design Power). Aluminum heat sink with Copper Core 3.5-inch fan Supports Intel Core i7, Core i3 and Core i5 Socket 1155/1156 processors with up to 95W TDP (Thermal Design Power) Supports Intel CPU socket type: LGA 1150 / 1151 / 1155 / 1156

Material: pure aluminum Color: Silver Dimensions: 64mm x 52mm x 28mm Durable and practical Convenient to use Easy to install and disassemble Service life is long Designed to maximize its surface area Replacement radiator for TO-3PL transistor and other IC chips

Product Name: Insulator Pads Material: Silicon Fit for: TO-220Transistor Size: 13 x 18 x 0.3mm(L x W)

durable, firm and stable for us to use.for easily installation.The thermal pads can use to fill the master chip and flash memory chips height and increase the cooling effect.Nano heat-conducting silica gel pad. Good ductility, compatible with uneven surfaces. Low viscosity, easy to Remove.Groove design greatly Increases the heat dissipation area, with 5 Celsius- 15 Celsius cooling effect (varies depending on the environment).Universal fit for 22 x 80 size (22x80mm) M.2 NVME SSD.

M2 solid-state SSD all aluminum heat sink. High speed heat dissipation, protect hard disk, extend the service life of hard disk All aluminum alloy, fast cooling. Made of all aluminum alloy, three-layer hollow cooling deck design, heat dissipation is fast, hard disk use is more stable, game / office is not stuck It is equipped with 3 pieces of thermal conductive silica gel, which can quickly consume the heat of the hard disk through the heat sink. It can protect the hard disk data from loss It is compatible with nvme / ngff dual protocol hard disk. It is suitable for mvme + ngff SSD, and compatible with 22x80 SSD

Brand: Thermalright 85x45mm Color: gray Denstity (g/cc): 3.1±0.2 Hardness (Sc): 30~55 Themal Conducivity: 12.8 w/mk Breakdown voltge: 9.8KV (1mm) Ultimate Heat Conductivity Non-Electrical Conductive Non-Corrosive, Non-Curing & Non-Toxi

Soft and easy to apply. Low viscosity, High thermal conductivity rate. Can be cut to any desired size. Very good malleability. Soft and easy to apply. Low viscosity, High thermal conductivity rate. Can be cut to any desired size. Very good malleability. Not electric conductive to prevent any electronic damage.

Blue pads Silicone pads CPU pads Thermal pad CPU Thermal pad

Thermal Conductivity: 3.2w/m-KBreakdown Voltage: 4kv/mm Size: 100mm x 100mm x 1mm Thickness: 1mm Continuous Temp: -40℃-260℃ High Stability and reliability Apply to CPU, VGA, LED, Chipset and other PC components Compliance with RoHS REACH PFOS requirements

Easy-to-use Syringes. Easy to remove too. High thermal conductivity, low bleed, stable at high temperatures. Thermal conductivity: >0.65 W/m-k. Suitable for CPU, chipsets on Mainboard, VGA card, etc.

  HEATSINK SPECIFICATION Dimension (with fan) L87 mm x W102 mm x H124.6 mm Weight (with fan) 425 g Weight (without fan) 345 g Heat pipes 6mm heatpipe x 3 units Fin T = 0.4 mm; Gap = 1.6 mm Fin Pcs 40 pcs Copper Base C1100 Pure copper nickel plated RAM Height Limit Limitless TDP 120 W    

  HEATSINK SPECIFICATION Dimension (with fan) L98 mm x W123 mm x H145 mm Weight (with fan) 711 g Weight (without fan) 577 g Heat pipes 6mm heatpipe x 3 units Fin T = 0.4 mm; Gap = 2.2 mm Front Fin Pcs 40 pcs Copper Base C1100 Pure copper nickel plated RAM Tolerance Height Limitless TDP 140 W

  HEATSINK SPECIFICATION Dimension (with fan) L98 mm x W143 mm x H160 mm Weight (with fan) 853 g Weight (without fan) 764 g Heat pipes 6mm heatpipe x 4 units Fin T = 0.4 mm; Gap = 2.8 mm Fin Pcs 38 pcs Copper Base C1100 Pure copper nickel plated RAM Height Limit Limitless TDP 160 W    

  HEATSINK SPECIFICATION Dimension (with fan) L128.5 mm x W140 mm x H168.3 mm Weight (with fan) 1215 g Weight (without fan) 970 g Heat pipes 6mm heatpipe x 7 units Front Fin T = 0.4 mm; Gap = 2.4 mm Front Fin Pcs 42 pcs Rear Fin T = 0.4 mm; Gap = 1.8 mm Rear Fin Pcs 53 pcs Copper Base C1100 Pure copper nickel plated Distance From Center 35.5 mm RAM Height Limit Limitless TDP 240 W+ XF140 SPECIFICATION Dimension L140 mm x W140 mm x H25.4 mm Weight 156 g Rated Speed 700 ~ 1300 RPM ±10 % Noise Level 19 ~ 23 dBA Air Flow 76 CFM Air Pressure 1.44 mmH2O Ampere 0.16 A XT140 SPECIFICATION Dimension L140 mm x W140 mm x H13 mm Weight 89 g Rated Speed 700 ~ 1300 RPM ±10 % Noise Level 20 ~ 24 dBA Air Flow 65 CFM Air Pressure 1.49 mmH2O Ampere 0.27 A

  HEATSINK SPECIFICATION Dimension (with fan) L142.4 mm x W140 mm x H168.3 mm Weight (with fan) 1282 g Weight (without fan) 970 g Heat pipes 6mm heatpipe x 7 units Front Fin T = 0.4 mm; Gap = 2.4 mm Front Fin Pcs 42 pcs Rear Fin T = 0.4 mm; Gap = 1.8 mm Rear Fin Pcs 53 pcs Copper Base C1100 Pure copper nickel plated Distance From Center 40 mm RAM Height Limit 30 ~ 35 mm (Fan position adjustable) TDP 250 W+     R1 ULTIMATE VS R1 UNIVERSAL

Heatsink Material: Copper & Aluminum Application: Industry/Car/ incubators/pc Condition: Used Frame Size: 4 inch aprox Frame Material: UL 94V-0 PBT+30%GF Black Bearing type: sleeve Life Expectancy: 60000 hours Working tempreture: -20℃~80℃ Certification: UL ROHS CCC CE speed: 3000RPM volt: 12v weight: 78g approx noise level: 25-38 db-a

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or mechanical device, thereby regulating the device's temperature to optimal levels. In computers, heat sinks, are used to cool central processing units or graphics processors. The Heatsink has Copper Base and Pipes for more extra heat dissipation. This Heatsink has Fins for Extra Heat Dissipation and more Efficiency. It can be used as heatsink for LED It can be used as heatsink for RAM It can be used as heatsink for PC It can be used as heatsink for CPU It can be used as heatsink for Peltier Module It can be used as heatsink for RAM ddr3 It can be used with Transistors, IC, Processors etc. It is a High Quality Heavy Heat sink Made of Copper and Aluminum You can attach 1 ThermoPeltier Modules with this heatsink.

GAME IN STYLE The MPG series brings out the best in gamers by allowing full expression in color with advanced RGB lighting control and synchronization. Experiment on another level of personalization with a front LED strip that provides convenient in-game and real time notifications. With the MPG series, transform your equipment into the center of attention and top leaderboards in style.     MPG Z490 GAMING EDGE WIFI Premium thermal solution   Aluminum Cover All-metal extended heatsink cover enlarges the surface of heat dissipation, ensuring even high-end processors to run in full speed. M.2 Shield Frozr Strengthened built-in M.2 thermal solution. Keeps M.2 SSDs safe while preventing throttling, making them run faster. Pump Fan Support Control watercooling pump speeds for best flow and noise control. Heatsinks with 7W/mK Thermal Pad 7W/mK thermal pad provides better heat transfer to the heatsink   MPG Z490 GAMING EDGE WIFI HIGH-SPEED TRANSMISSION   Lightning 20G Built-in USB 3.2 Gen 2x2 port, offers the 20Gbps transmission speed, 4X faster than USB 3.2 Gen 1. Intel Wi-Fi 6 The latest wireless solution supports MU-MIMO and BSS color technology, delivering speeds up to 2400Mbps. 2.5G Network Solution Featuring premium 2.5G LAN with LAN manager delivers better network experience. DDR4 Boost The fully isolated DDR circuit to deliver pure data signals for the best gaming and overclocking performance. Twin Turbo M.2 With 2 x M.2 slots. Running at PCI-E Gen3 x4 maximizes performance for NVMe based SSDs.   MPG Z490 GAMING EDGE WIFI EXCLUSIVE FEATURE   Core Boost Technology Combining 8+4 pin power connectors and premium layout design, that is ready for unleashing the maximum performance. 6-Layer PCB 6 layer PCB provides higher performance and long-lasting system stability without any compromise. Digital PWM Highest quality component digital power IC makes sure your system runs smoothly under the most extreme conditions. PCI-E Steel Armor Protecting VGA cards against bending and EMI for better performance, stability and strength.   MPG Z490 GAMING EDGE WIFI premium thermal solution   Aluminum Cover All-metal extended heatsink cover enlarges the surface of heat dissipation, ensuring even high-end processors to run in full speed. M.2 Shield Frozr Strengthened built-in M.2 thermal solution. Keeps M.2 SSDs safe while preventing throttling, making them run faster. Pump Fan Support Control watercooling pump speeds for best flow and noise control. Heatsinks with 7W/mK Thermal Pad 7W/mK thermal pad provides better heat transfer to the heatsink   MPG Z490 GAMING EDGE WIFI HIGH-SPEED TRANSMISSION   Lightning 20G Built-in USB 3.2 Gen 2x2 port, offers the 20Gbps transmission speed, 4X faster than USB 3.2 Gen 1. Intel Wi-Fi 6 The latest wireless solution supports MU-MIMO and BSS color technology, delivering speeds up to 2400Mbps. 2.5G Network Solution Featuring premium 2.5G LAN with LAN manager delivers better network experience. DDR4 Boost The fully isolated DDR circuit to deliver pure data signals for the best gaming and overclocking performance. Twin Turbo M.2 With 2 x M.2 slots. Running at PCI-E Gen3 x4 maximizes performance for NVMe based SSDs.   MPG Z490 GAMING EDGE WIFI EXCLUSIVE FEATURE   Core Boost Technology Combining 8+4 pin power connectors and premium layout design, that is ready for unleashing the maximum performance. 6-Layer PCB 6 layer PCB provides higher performance and long-lasting system stability without any compromise. Digital PWM Highest quality component digital power IC makes sure your system runs smoothly under the most extreme conditions. PCI-E Steel Armor Protecting VGA cards against bending and EMI for better performance, stability and strength.   MPG Z490 GAMING EDGE WIFI premium thermal solution   Aluminum Cover All-metal extended heatsink cover enlarges the surface of heat dissipation, ensuring even high-end processors to run in full speed. M.2 Shield Frozr Strengthened built-in M.2 thermal solution. Keeps M.2 SSDs safe while preventing throttling, making them run faster. Pump Fan Support Control watercooling pump speeds for best flow and noise control. Heatsinks with 7W/mK Thermal Pad 7W/mK thermal pad provides better heat transfer to the heatsink PREMIUM HARDWARE DESIGN With years of experience, MSI is no stranger to building high-performance motherboards. Our R&D and engineering teams have reviewed countless designs, evaluated a wide selection of high quality components, and developed products for reliability even under extreme conditions.   THERMAL SOLUTION FOR MORE CORES AND HIGHER PERFORMANCE With more cores’ processors, thermal and power design is more important to make sure the temperature keeps lower. MSI extended PWM heatsink and enhanced circuit design ensures even high-end CPU to run in full speed with MSI motherboards. M.2 SHIELD FROZR World’s fastest SSDs can start to lower performance when getting hot. Part of the motherboards heatsink design, M.2 SHIELD FROZR is the next generation M.2 thermal solution to avoid this by offering the best thermal protection to make sure that SSD maintains maximum performance. With MSI M.2 Shield FROZR - Prevents throttling - Maximizes drive performance - Higher maximum SSD speeds      

Satisfying gamers with what they really need, MPG X570 GAMING PLUS is equipped with Extended Heatsink Design, Frozr Heatsink Design, Core boost, Lightning Gen4 M.2, M.2 Shield Frozr accessory, Turbo USB and MSI latest Dragon Center Supports 2nd and 3rd Gen AMD Ryzen™ / Ryzen™ with Radeon™ Vega Graphics and 2nd Gen AMD Ryzen™ with Radeon™ Graphics Desktop Processors for Socket AM4 Supports DDR4 Memory, up to 4400+(OC) MHz Lightning Fast Game experience: PCIe 4.0, Lightning Gen4 x4 M.2 with M.2 Shield Frozr accessory, StoreMI, AMD Turbo USB 3.2 GEN2 Frozr Heatsink Design:  Designed with the patented fan and double ball bearings to provide the best performance for enthusiast gamers and prosumers.   Set Core Power Free: Extended Heatsink Design, Core Boost, Digital PWM IC, 8+4 pin CPU power connector, Game Boost, DDR4 Boost MYSTIC LIGHT: 16.8 million colors / 29 effects controlled in one click. MYSTIC LIGHT EXTENSION supports both RGB and RAINBOW LED strip. AUDIO BOOST 4: Reward your ears with studio grade sound quality for the most immersive gaming experience Dragon Center: A brand new software which integrates all MSI tools like GAME MODE, VOICE BOOST, LIVE UPDATE  with user friendly user interface.   

Description: Details Asus Gaming Motherboard Delivered All Over Pakistan.   iShopping.pk brings you the best price for Asus Rog Strix ATX Wi-Fi Gaming Motherboard (Z590-A) with express shipping all over Pakistan.   Details: ASUS Prime series motherboards are expertly engineered to unleash the full potential of 10th and 11th Generation Intel® Core™ processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, Prime Z590-A provides daily users and DIY PC builders a range of performance tuning options via intuitive software and firmware features. ASUS Prime Z590-A is perfect for those seeking to create a sleek, futuristic-looking build, thanks to its black and white finish and iridescent metallic nameplate and PCB cover.   Tune It Your Way Comprehensive controls form the foundation of the ASUS Prime series. The Prime Z590 motherboard packs flexible tools to tune every aspect of your system, enabling performance tweaks to perfectly match the way you work to maximize productivity.   Cool to the Core Prime Z590 series is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.   M.2 Heatsink Two M.2 heatsinks take care of the three M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers. The heatsinks are held in place by captive screws and can be moved to other M.2 slots.   Build on a Solid Foundation Prime Z590 series is built to handle the additional cores and increased bandwidth of 11th Generation Intel® Core™ processors. ASUS Z590 motherboards provide all the fundamentals to boost daily productivity, so your system will be ready for action with stable power, intuitive cooling and flexible transfer options. Robust Power Design Stable power is essential to extract every last bit of performance out of 11th Generation Intel® Core™ processors. Prime Z590-A is geared to cater to the demands of these high-core count CPUs.   ProCool Connectors Proprietary connectors augment the motherboard's link to the PSU with 8+4 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.   Small Details Make a Big Difference Prime Z590 series adds the nuanced details that improve every experience, from exclusive codecs that provide pristine audio quality to intuitive RGB lighting controls that let you customize your system to create a uniquely personal look.   TWO-WAY AI NOISE CANCELATION This utility leverages a massive deep-learning database to reduce background noise from the microphone and incoming audio, while preserving vocals at the same time. This removes distracting keyboard clatter, mouse clicks and other ambient noises so you can hear and be heard with crystal clarity while gaming or in calls. Features: • Intel® LGA 1200 socket: Ready for 10th and 11th gen Intel® Core™ processors • Enhanced power solution: 14+2 DrMOS power stages, six-layer PCB, ProCool sockets, alloy chokes and durable capacitors for stable power delivery • AI Overclocking: Optimizes CPU performance based on the CPU and cooler, achieving results that are extremely close to manual tuning by experts • AI Cooling: Manages and controls all motherboard fans, automatically optimizing settings based on current system load and temperature • Two-way AI Noise Cancelation: Reduces background noise from the microphone and audio output for crystal-clear communication in games or video conferences • Comprehensive cooling: Large VRM heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 • Next-gen connectivity: PCIe® 4.0, Intel® 2.5 Gb Ethernet, USB 3.2 Gen 2x2 Type-C®, front panel USB 3.2 Gen 1 Type-C®, Thunderbolt™ 4 header support