Gcc thermal conductivity

At the same time, the product is sticky and easy to use. The silica gel sheet is made of a flexible silicone thermal conductive material with stable heat conduction, insulation properties, and softness and elasticity. It is placed between the heater and The pad is specially designed for the use of heat transfer through the interval, which can fill the interval and effectively transfer the heat of the heat-generating component to the heat sink. Thermally conductive silicone sheet has excellent thermal conductivity to meet the thermal insulation requirements of most electronic products. Applicable to graphics card North-South bridge, home appliances, high-speed hard drive, micro heat pipe radiator, high-power, LED industry. Good thermal conductivity, insulation, viscosity, elasticity, low heat resistance, filling.

The pad is specially designed for the use of heat transfer through the interval, which can fill the interval and effectively transfer the heat of the heat-generating component to the heat sink. Applicable to graphics card North-South bridge, home appliances, high-speed hard drive, micro heat pipe radiator, high-power, LED industry. Thermally conductive silicone sheet has excellent thermal conductivity and meets the thermal insulation requirements of most electronic products. The pad has viscosity, simple and convenient application, stable heat conduction, insulation and softness and flexibility. Good thermal conductivity, insulation, viscosity, elasticity, low heat resistance, filling.

Thermal Conductivity: 12.5w/mK Thermal Resistance: 0.0032k/w Conductivity: 0ps/m Volume: 1 Gram

Thermal Grease Paste Compound Silicone for CPU Heat Sink The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards. Thermal coupling of electrical / electronic device to heat sinks High Thermal Conductivity, Low Bleed and Stable at high temperature

Thermal Conductivity: 3.2w/m-KBreakdown Voltage: 4kv/mm Size: 100mm x 100mm x 1mm Thickness: 1mm Continuous Temp: -40℃-260℃ High Stability and reliability Apply to CPU, VGA, LED, Chipset and other PC components Compliance with RoHS REACH PFOS requirements

KRYONAUT EXTREME Thermal Grizzly  Kryonaut Extreme  is a high-performance thermal paste based on our proven Kryonaut paste. Maximum thermal conductivity through the smallest particle size and layer thickness, combined with improved low-temperature resilience is the basis for the best temperatures in extreme overclocking. Especially for overclocking 14.2 W / m * K thermal conductivity No curing High long-term stability operation area Rating Thermal conductivity ***** Sub-zero overclocking ***** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - Thermal Grizzly  Kryonaut Extreme  is an extremely powerful thermal  compound  with improved application and additional electrically non-conductive nano-aluminium oxide particles. The smallest possible particle size allows microscopic unevenness to be better filled and thus enables better thermal conductivity. Developed over several years in cooperation with renowned engineers and pro overclockers, Thermal Grizzly offers  Kryonaut Extreme  the new top product especially for extreme overclocking - both in the low-temperature range such as B. with liquid nitrogen and at ambient temperature such as with water cooling. Electrical conductivity * 0 pS / m viscosity 130-180 pas density 3.76g / cm3 temperature -250 ° C / +350 ° C content 9 ml / 2 g

HYDRONAUT With its excellent thermal conductivity,  Hydronaut  can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example. Suitable for overclocking  Excellent thermal conductivity No curing Silicone free Not electrically conductive Applicable to aluminium coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity **** Sub-zero overclocking **** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications ***** The  Hydronaut  Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector. The  Hydronaut  thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily. Hydronaut  achieves optimal values ??for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users. Thermal resistance 0.0076 K / W Electrical conductivity * 0 pS / m  viscosity  140-190 pas  Spec. Weight   2.6g / cm3  temperature  -200 ° C / +350 ° C  content  1.5ml / 3.9g - 3ml / 7.8g    * according to DIN 51412-1

HYDRONAUT With its excellent thermal conductivity,  Hydronaut  can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example. Suitable for overclocking  Excellent thermal conductivity No curing Silicone free Not electrically conductive Applicable to aluminium coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity **** Sub-zero overclocking **** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications ***** The  Hydronaut  Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector. The  Hydronaut  thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily. Hydronaut  achieves optimal values ??for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users. Thermal resistance 0.0076 K / W Electrical conductivity * 0 pS / m  viscosity  140-190 pas  Spec. Weight   2.6g / cm3  temperature  -200 ° C / +350 ° C  content  1g

CONDUCTONAUT The  Conductonaut  liquid metal thermal paste was developed for applications with a high degree of efficiency. The  Conductonaut is  recommended as a top product for experienced users who are looking for a solution with the best heat dissipation in a temperature range of over 8 ° C.  Ultra-high thermal conductivity Increased indium content  Optimal application through the plastic needle   operation area Rating Thermal conductivity ******* Sub-zero overclocking * Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - Thermal Grizzly  Conductonaut  is a liquid metal thermal paste based on a eutectic alloy. A very high thermal conductivity is achieved through a special mixture of the metals tin, gallium and indium, among others. We recommend applying Conductonaut on nickel-plated copper, as this offers the best long-term stability.  viscosity  0.0021 Pas density  6.24g / cm3 Recommended temperature  10 ° C / +140 ° C content 1 g Note: The Conductonaut thermal paste must not be used with aluminium coolers! Note: Conductonaut is a metal alloy and can leave behind optical residues. For the best long-term performance, we recommend heat sinks with nickel-plated copper bases. 

KRYONAUT The  Kryonaut thermal  paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community.  Kryonaut  is also recommended as a top product for critical cooling systems in the industrial sector. Especially for overclocking Excellent thermal conductivity No curing High long-term stability Not electrically conductive Applicable to aluminum coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity ***** Sub-zero overclocking ***** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - "Kryo" - the Greek word for "cold", which is also used in cryotechnology - indicates that the   Kryonaut  thermal paste is specially designed for use in the low-temperature range - it was developed for the true "cryonauts" among the "extreme overclockers". Kryonaut  uses a special support structure that does not begin to dry out even at 80 ° C. This support structure ensures that the nano-aluminium and zinc oxide components of the paste are optimally combined and unevenness in the heat carrier (e.g. the CPU) and a heat sink (e.g. heat sink) are optimally compensated for with excellent thermal conductivity.

GD900 Thermal Paste 2x Sachet Bag Packaging Color: Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit

GD007 Thermal Paste 2x Sachet Bag Packaging Color: Gray Specific Gravity: 2.5 G/Cc Thermal Conductivity: 6.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit

GD900 Thermal Paste Pack of 10x Sachet Bag Packaging Color: Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit

Weight: 1 gram Thermal conductivity: 12.5w/mK Thermal resistance: 0.0032k/w Conductivity: 0ps/m

GD007 Thermal Paste 10x Sachet Bag Packaging (0.5gram Each) Color: Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 6.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit