Cooler master thermal paste

CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer. Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities. Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer.

DESCRIPTION Brand: Cooler Master Product: Air Cooler Product Type: Folding Fin, 6 Direct Contact heatpipes Product Name: Cooler Master Hyper 612 Ver.2 - Silent CPU Air Cooler with 6 Direct Contact Heatpipes and Folding Fin Structure Silent CPU Air Cooler with 6 Direct Contact Heatpipes and Folding Fin Structure. HYPER 612 VER.2 The hyper 612 ver. 2 includes a PWM controlled fan and provides incredible 11 dB low noise while sustaining excellent cooling performance. Exclusive CDC™ technology, folding fin design, wider fin gaps, and a special 6 heatpipe layout crossing the CPU’s “hot spot,” the Hyper 612 ver. 2 CPU cooler is optimized for superior heat dissipation at low fan speeds, rescuing your machine from a noisy nightmare. Hyper 612 Ver 2 Six Heatpipe Air Cooler The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system. • Six Direct Contact Heat pipes for accelerated surface to surface thermal transfer • Folding Fin Structure for the best air guiding and increased efficiency and heat dissipation • One Intelligent 120mm PWM Fan for high airflow with incredibly low noise output • Easy installation for quick mounting and dismounting Mention that you found this ad on DealMarkaz.pk when you call.

The New MasterGel Pro has an exclusively flat-nozzle syringe designed to enhance the application experience. Range of thermal conductivity that matches cooling requirements and aids heat transfer from CPU/GPU to your cooler.

Introducing our New Edition MasterGelSeries, with our new exclusive flat-nozzle syringe design which enhances the user experience by making the application process as simple as possible. This new design eliminates the process of having to use a scrapper and mess that comes with applying thermal grease.

  odel MGX-ZOSW-N15M-R1 Color White Specific Gravity 2.4 Thermal Conductivity >5 W/m-K Volume 1.5g Extra Scraper Grease Cleaner

MASTERGEL REGULAR HIGH PERFORMANCE THERMAL GREASE Enhanced User Experience Design Precise and Even High Conductivity to aid heat transfer

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed, and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Suitable for CPU, chipsets on Mainboard, VGA card, etc. Easy to use. ZIF Socket Templates ensure correct applying area with various CPU socket types. Produces an even layer when using the applicator. Dielectric. Wide range of application temperature

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K Specification Features - High Viscosity Allows For Easy Application - Nanotechnology Improves Heat Conduction - Non-electric Conductive Material Ensure Safe Usage - Low Evaporation Point & High Temperature Tolerance - Spreader Allows For Quick & Easy Application - Thermal Conductivity > 5.15W/m-K

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K

GD900 Thermal Paste Grease Heat Sink Compound High Performance Net Weight 1 Gram For CPU GPU Cooler Gray Conductive Cooling Fan Processors Silicone Plaster

The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC/xe2/x80/x98s MX-4 is composed of carbon microparticles which fill these cavities.

High grade stability and reliability. Apply to CPU, VGA, chipset, radiator and other PC components. Helps disperse the heat from CPU to heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High temperature resistance. Non-toxic, tasteless, non-corrosive. Thermal Grease for Laptop Desktop CPU Cooler heatsink Thermal Compound Paste HY510 (1g) By Shah Ansari

The thermal compound paste is made of high quality. Its outstandingperformance on the CPU GPU LED will meet your high standard demand forcooling system. Thermal coupling of electric/electronic devices to heat sinks High conductivity; stable at high temperature Eliminate any risks of causing short circuit Dissspate effectively of CPU or GPU Easy to apply and avoid voids between CPU and cooler