Aluminum sink

durable, firm and stable for us to use.for easily installation.The thermal pads can use to fill the master chip and flash memory chips height and increase the cooling effect.Nano heat-conducting silica gel pad. Good ductility, compatible with uneven surfaces. Low viscosity, easy to Remove.Groove design greatly Increases the heat dissipation area, with 5 Celsius- 15 Celsius cooling effect (varies depending on the environment).Universal fit for 22 x 80 size (22x80mm) M.2 NVME SSD.

M2 solid-state SSD all aluminum heat sink. High speed heat dissipation, protect hard disk, extend the service life of hard disk All aluminum alloy, fast cooling. Made of all aluminum alloy, three-layer hollow cooling deck design, heat dissipation is fast, hard disk use is more stable, game / office is not stuck It is equipped with 3 pieces of thermal conductive silica gel, which can quickly consume the heat of the hard disk through the heat sink. It can protect the hard disk data from loss It is compatible with nvme / ngff dual protocol hard disk. It is suitable for mvme + ngff SSD, and compatible with 22x80 SSD

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or mechanical device, thereby regulating the device's temperature to optimal levels. In computers, heat sinks, are used to cool central processing units or graphics processors. The Heatsink has Copper Base and Pipes for more extra heat dissipation. This Heatsink has Fins for Extra Heat Dissipation and more Efficiency. It can be used as heatsink for LED It can be used as heatsink for RAM It can be used as heatsink for PC It can be used as heatsink for CPU It can be used as heatsink for Peltier Module It can be used as heatsink for RAM ddr3 It can be used with Transistors, IC, Processors etc. It is a High Quality Heavy Heat sink Made of Copper and Aluminum You can attach 1 ThermoPeltier Modules with this heatsink.

Material: pure aluminum Color: Silver Dimensions: 64mm x 52mm x 28mm Durable and practical Convenient to use Easy to install and disassemble Service life is long Designed to maximize its surface area Replacement radiator for TO-3PL transistor and other IC chips

KRYONAUT The  Kryonaut thermal  paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community.  Kryonaut  is also recommended as a top product for critical cooling systems in the industrial sector. Especially for overclocking Excellent thermal conductivity No curing High long-term stability Not electrically conductive Applicable to aluminum coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity ***** Sub-zero overclocking ***** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - "Kryo" - the Greek word for "cold", which is also used in cryotechnology - indicates that the   Kryonaut  thermal paste is specially designed for use in the low-temperature range - it was developed for the true "cryonauts" among the "extreme overclockers". Kryonaut  uses a special support structure that does not begin to dry out even at 80 ° C. This support structure ensures that the nano-aluminium and zinc oxide components of the paste are optimally combined and unevenness in the heat carrier (e.g. the CPU) and a heat sink (e.g. heat sink) are optimally compensated for with excellent thermal conductivity.

The reconfigured components of XPG V1.0 combine style and technology to create a newer and cooler approach to maintaining stability in demanding computer systems. The innovative engineering and unique appearance of the new XPG heat sinks make XPG V1.0 requisite gear for the most dedicated gamers and power users.      Crafted Lines and Outstanding Heat Dissipation Top-tier enthusiasts in all countries- from gamers, to power users, to system builders demand not only the best in heat dissipation and long term stability of DRAM, but they are increasingly looking for components that improve the overall appearance or attitude of their rigs. ADATA XPG V1.0 DRAM meets the demands of these groups, both technologically and aesthetically, and this improved heat sink is a strong step forward in this respect. With sleekly crafted lines reminiscent of the mechanical goliaths found on today’s electronic battlefields, the XPG V1.0 DRAM comes in colors of red, black, and blue, grouped higher to lower according to the respective module frequencies.    The Highest Standard for Stability and Efficiency ADATA XPG V1.0 memory products are made in conformation with JEDEC regulations and DDR3-1333 standards at CL value of 9-9-9-24. Each XPG V1.0 memory chip is selected through a strict filtering process, complete with high-quality PCBs (Printed Circuit Board) and an aluminum heat sink that effectively lowers module temperature, proven to reach a maximum speed of 2133MHz to make complete use of the computer’s power.     What is DDR3? DDR3 SDRAM stands for Double Data Rate Three Synchronous Dynamic Random Access Memory. Compared to DDR2 SDRAM, DDR3 SDRAM delivers higher performance, maintaining lower voltage levels and greatly improving data transfer rates.  ADATA XPG V1.0 Desktop Memory uses 240-pin standard design. Operating at 2133MHz and 1.5~1.65 volts, its transfer bandwidth can reach 17,000 MB/s (PC3-17000), blazing speed you won’t find elsewhere.    Lifetime Warranty, Quality Guaranteed In addition to ADATA’s rigorous manufacturing process, we ensure the quality of each memory module. All ADATA memory modules come with a lifetime limited warranty.  *All ADATA memory chips are stringently tested. However, actual performance may vary due to a computer’s motherboard, BIOS version, system configurations, operating system, system components, and other factors. Overclocking or changing the system clock may cause malfunction in some computer system components, and can even invalidate the computer’s warranty. Please read the computer user guide carefully or consult the manufacturer for more information.   

TP-Link Archer T4E AC1200 Wireless Dual Band PCI Express Adapter Price & Specs Easy Installation – Plug the adapter into an available PCI-E slot to upgrade your desktop High Speed Wi-Fi – Up to 1200 Mbps Wi-Fi speeds (867 Mbps on 5 GHz band and 300 Mpbs on 2.4 GHz band)* 802.11ac Dual Band – 3 times faster than the 802.11n standard, perfect for high-intensity network usage Beamforming – Wi-Fi signals are strengthened towards certain direction where client exists Multiple-Size Brackets – Low profile and full heigh brackets are both provided, suitable for all PCs 2×2 MIMO – Users can easily access to high-speed wireless connection Broad Wireless Range – Two external antennas ensure greater Wi-Fi coverage and enhanced stability AC1200 Wireless Dual Band PCI Express Adapter Archer T4E 802.11ac - Dual Band Wi-Fi for Faster Connections TP-LINK's Archer T4E supports the advanced Wi-Fi standard of IEEE 802.11ac, offering 3 times transferring rates as IEEE 802.11n. You can send emails and browse the web with 2.4GHz network, while keeping the speedy 5GHz band free for gaming, HD streaming and other bandwidth intensive applications. 867 Mbps 5 GHz Band 300 Mbps 2.4 GHz Band Greater Coverage with Beamforming Beamforming technology smartly focuses Wi-Fi signals towards connected devices for stable connections and boosted range. Other AC Adapter Beamforming Archer T4E Heat Sink for Ultimate Stability A heat sink helps to dissipate the thermal energy generated by the adapter, which in turn improves stability. Additionally, lower temperatures help to extend the product lifespan. Aluminum Alloy   External Antennas for More Targeted signal Two external antennas utilize the latest wireless technology to achieve stable connections and boosted coverage. Easy Setup Simple software installation with the intuitive Utility on the provided CD Advanced Security WAP,WPA/WPA2,WPA-PSK/WPA2-PSK encryption standards ensure your data is safe from intruders Operating System Supports Windows 10/8.1/8/7/XP(32/64 bit)** Low-Profile Bracket In addition to the standard bracket, a low-profile bracket is also provided for mini tower computer cases *Maximum wireless transmission rates are the physical rates derived from IEEE Standard 802.11 specifications. Range and coverage specifications are based upon test results under normal usage conditions. Actual wireless transmission rate and wireless coverage are not guaranteed, and will vary as a result of 1) environmental factors, including building materials, physical objects and obstacles, 2) network conditions, including local interference, volume and density of traffic, product location, network complexity, and network overhead and 3) client limitations, including rated performance, location, connection quality, and client condition. HARDWARE FEATURES Interface PCI Express Dimensions (W x D x H) 4.8 x 4.5 x 0.85 in (120.8*115.2*21.5 mm) Antenna Type 2 Dual Band Detachable Antennas   WIRELESS FEATURES Wireless Standards IEEE 802.11ac/n/a 5 GHz IEEE 802.11n/g/b 2.4 GHz Signal Rate 5 GHz 11ac: Up to 867 Mbps(dynamic) 11n: Up to 300 Mbps(dynamic) 11a: Up to 54 Mbps(dynamic) 2.4 GHz 11n: Up to 300 Mbps(dynamic) 11g: Up to 54 Mbps(dynamic) 11b: Up to 11 Mbps(dynamic) Reception Sensitivity 5 GHz: 11ac HT80: -59.5 dBm 11ac HT40: -63 dBm 11ac HT20: -68 dBm 11n HT40: -70 dBm 11n HT20: -73 dBm 11a 54Mbps: -76 dBm 11a 6Mbps: -92 dBm 2.4GHz: 11n HT40: -67.5 dBm 11n HT20: -70 dBm 11g 54Mbps: -72 dBm 11b 11Mbps: -86.5 dBm Transmit Power 5 GHz: 24 dBm(FCC) / 23dBm(CE) (EIRP) 2.4 GHz: 25 dBm(FCC) / 20dBm(CE) (EIRP) Wireless Modes Infrastructure mode Wireless Security Support 64/128 bit WEP, WPA/WAP2, WPA-PSK/WPA2-PSK, 802.1x Modulation Technology DBPSK, DQPSK, CCK, OFDM, 16-QAM, 64-QAM, 256-QAM   OTHERS Certification FCC, RoHS Package Contents AC1200 Wireless Dual Band PCI Express Adapter Archer T4E Low-Profile Bracket Quick Installation Guide Resource CD System Requirements Windows 10/8.1/8/7/XP (32/64bit) Environment Operating Temperature: 0℃~40℃ (32℉~104℉) Storage Temperature: -40℃~70℃ (-40℉~158℉) Operating Humidity: 10%~90% non-condensing Storage Humidity: 5%~90% non-condensing

Adjustable Gears: 10 gears Adjust Height: About 8-15cm Ergonomic Design: 10 Levels Adjustable Ergonomics-Multiple angles can be set (maximum 155mm,minimum of 55mm) And line of sight varies with angle adjustment. This helps correct posture, relieve neck and back pain, wrist pain, and eye strain. Ventilated and Dissipated: It is good for ventilation and can also be used as a heat sink to help with cooling. Don't worry about burning the motherboard. Steadiness and Durability:Made of high quality aluminum alloy makes the laptop riser more sturdy; Non-skid pad keep the notebook riser stable and protects your device / desktop surface once placed on. Foldable and Portable Design:This portable folding stand weighs only 0.3kg. Small foldable, Amazing construction. Makes it ideal for carrying, you can put it in your backpack or laptop bag.

Condition Used / Seller Refurbished pulled from branded PCs Cooler One Socket-1156 Cooler supports Intel Core i7, Core i3 and Core i5 LGA-1150/1151/1155/1156 processors with up to 95W TDP (Thermal Design Power). Aluminum heat sink with Copper Core 3.5-inch fan Supports Intel Core i7, Core i3 and Core i5 Socket 1155/1156 processors with up to 95W TDP (Thermal Design Power) Supports Intel CPU socket type: LGA 1150 / 1151 / 1155 / 1156

Condition Used / Seller Refurbished pulled from branded PCs Cooler One Socket-1156 Copper Core Cooler supports Intel Core i7, Core i3 and Core i5 LGA-1150/1151/1155/1156 processors with up to 95W TDP (Thermal Design Power). Aluminum heat sink with Copper Core 3.5-inch fan Supports Intel Core i7, Core i3 and Core i5 Socket 1155/1156 processors with up to 95W TDP (Thermal Design Power) Supports Intel CPU socket type: LGA 1150 / 1151 / 1155 / 1156

Ergonomic Design:6 levels adjustable ergonomicsmultiple-angles can be set (maximum 118mm,minimum of 69mm) And line of sight varies with angle adjustment. This helps correct posture, relieve neck and back pain, wrist pain, and eye strain. Ventilated and Dissipated: It is good for ventilation and can also be used as a heat sink to help with cooling. Don't worry about burning the motherboard. Steadiness and Durability:Made of high quality aluminum alloy makes the laptop riser more sturdy; Non-skid pad keep the notebook riser stable and protects your device / desktop surface once placed on. Portable Design:This portable folding stand weighs only 0.25kg. Small foldable, Amazing construction. Makes it ideal for carrying, you can put it in your backpack or laptop bag.