ALUMINUM HEATSINK CHIPSET HEAT SINK,WITH COOLING PAD,FOR IN PAKISTAN
durable, firm and stable for us to use.for easily installation.The thermal pads can use to fill the master chip and flash memory chips height and increase the cooling effect.Nano heat-conducting silica gel pad. Good ductility, compatible with uneven surfaces. Low viscosity, easy to Remove.Groove design greatly Increases the heat dissipation area, with 5 Celsius- 15 Celsius cooling effect (varies depending on the environment).Universal fit for 22 x 80 size (22x80mm) M.2 NVME SSD.
4.00/5
1 reviews
Price:
Rs 387,00
Rs 387,00
Contact
CONTACT